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Solder Flux Lead-Free Low Temperature Solder Paste Welding For Phone Repair Plant Tin BGA-Plant Tin
Price (USD): $9.99 / piece
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Note: For sizings issues, we can exchange it for free.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
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100% Satisfaction Guarantee: If item arrives damaged/missing/wrong, Lizii will make compensation based on the damage situation.
Quality Guarantee: If the item you purchased has quality issues, Lizii will provide comprehensive after-sale service.
Return & Refund: Your purchased items can be returned for a refund with no reason within 7 days of delivery.Specifications
- Particle Size: 25-48μm
- Model Number: XJ-20
- Type: Lead-free low temperature solder paste
- Melting point: 138°
- Application: Phone repair plant tin, BGA-plant tin
- Code: 30XJ-20
- Package Weight: 0.03kg (0.07lb.)
- Package Size: 6cm x 6cm x 3cm (2.36in x 2.36in x 1.18in)
Description
Conditions: Buyer shall pay all shipping cost for warranty services. Warranty does not cover physical damages.
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