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MECHANIC XG50 XGSP50 Sn63/Pb37 Solder Tin Paste Melting Point 183℃ Soldering Flux Paste For Phone PCB Board SMD Chips Repair
Price (USD): $9.99 / piece
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Note: For sizings issues, we can exchange it for free.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
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Customer Service Guarantee
100% Satisfaction Guarantee: If item arrives damaged/missing/wrong, Lizii will make compensation based on the damage situation.
Quality Guarantee: If the item you purchased has quality issues, Lizii will provide comprehensive after-sale service.
Return & Refund: Your purchased items can be returned for a refund with no reason within 7 days of delivery.Specifications
- Particle Size: 20-38μm
- Model Number: XG50 / XGSP50
- Origin: Mainland China
- Certification: CE
- Melting Point: 183℃
- XG50 Gross Weight: About 35.0g / pcs
- XGSP50 Gross Weight: About 42.0g / pcs
- Package Weight:
- Package Size:
Description
Conditions: Buyer shall pay all shipping cost for warranty services. Warranty does not cover physical damages.
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