Qianli Middle Layer Board BGA Reballing Stencil Plant Tin Platform For IPhone X XS 11 12 12Pro 13Pro Max Logic Board Rework Tool
Price (USD): $41.99 ~ 59.99 / piece
Color:
Shipping:
Note: For sizings issues, we can exchange it for free.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
Payments:
Recently Viewed Items
-
Customer Service Guarantee
100% Satisfaction Guarantee: If item arrives damaged/missing/wrong, Lizii will make compensation based on the damage situation.
Quality Guarantee: If the item you purchased has quality issues, Lizii will provide comprehensive after-sale service.
Return & Refund: Your purchased items can be returned for a refund with no reason within 7 days of delivery.Specifications
- Particle Size: 1-10μm
- Model Number: Qianli BGA Reballing Fixture
- Origin: Mainland China
- Certification: NONE
- Usage: Repair Tools for iPhone X/XS/XS MAX/11/11Pro/11Pro Max
- Feature: Motherboard Middle Layer Planting Tin Platform
- Application: Middle Layer Board Repairing for iPhone X/XS/XS MAX/11/11 Pro/Max
- Function: BGA Reballing for iPhone 12 13
- Package Weight:
- Package Size:
Description
Conditions: Buyer shall pay all shipping cost for warranty services. Warranty does not cover physical damages.
Write a reviewCustomer Reviews
Have questions? Please submit a question here!Enquiries
Help: Please search FAQ for typical questions before asking here.