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  • Customer Service Guarantee

    100% Satisfaction Guarantee: If item arrives damaged/missing/wrong, Lizii will make compensation based on the damage situation.
    Quality Guarantee: If the item you purchased has quality issues, Lizii will provide comprehensive after-sale service.
    Return & Refund: Your purchased items can be returned for a refund with no reason within 7 days of delivery.

    Specifications

    • Particle Size: 25-48μm
    • Model Number: XG-Z40
    • Item Name: BGA Soldering Tin Cream
    • Design: Needle Tube
    • Alloy: Sn63/Pb37
    • Type 2: BGA Soldering Paste
    • Model 2: Dispenser Needle Solder
    • Volume: 10ml
    • Product: XG-Z40 / XG-50
    • Microns: 25-38um
    • Application: Applicable to Phone PCB, BGA, SMD, PGA Repair
    • Usage: PCB BGA Repairing Tool
    • Function: Repair the Circuit Boards, Protect The Electronic Components
    • Features 1: High Viscosity No-clean Flux
    • Features 2: High Synthetic BGA Solder Flux
    • Features 3: Avoid the Pale Yellow Residue
    • Suitable for: Phone, Computer Repair Industry
    • Material: Tin+Solder Paste
    • 100%: High Quality
    • Size 2: Approx 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
    • : Support
    • Quantity: One/Lots
    • With Squeeze Tube: Yes
    • Is-customized: No
    • DIY Type: Computer, Phone Chip Reballing
    • temperature: 183
    • Package Weight:
    • Package Size:

    Description



    Conditions: Buyer shall pay all shipping cost for warranty services. Warranty does not cover physical damages.

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