AMTECH NC-559-ASM BGA Soldering Tin Cream For Mobile Phone Motherboard Soldering Repair Tool
Price (USD): $9.99 ~ 13.99 / piece
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Note: For sizings issues, we can exchange it for free.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
Refund: Full refund application available if not satisfied. We aim for 100% customer satisfaction.
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Quality Guarantee: If the item you purchased has quality issues, Lizii will provide comprehensive after-sale service.
Return & Refund: Your purchased items can be returned for a refund with no reason within 7 days of delivery.Specifications
- Particle Size: 20-38μm
- Model Number: AMTECH NC-559
- Origin: Mainland China
- Certification: NONE
- Item Name: AMTECH Unleaded Soldering Flux
- Color: Transparent
- Material: Lead Free Tin Solder Paste
- Function: Electronics Welding
- Application: for Phone BGA Reballing
- Type 2: Lead-free Solder Paste
- Volume: 10CC
- Feature 1: Lead Free, Environmental-Friendly
- Flux: NC-559-ASM
- Usage: for Phone Welding Tool
- Features 2: Transparent Residue, No Halogen
- Design: Needle-Tube
- With Syringe Push: Yes
- Length of Syringe Push: 95mm
- Color of Syringe Push: White
- Features 3: Low Solder Ball Rate
- Features 4: Excellent Wetting Ability On PCB
- Packing: Bag
- : Support
- Package Weight:
- Package Size:
Description
Conditions: Buyer shall pay all shipping cost for warranty services. Warranty does not cover physical damages.
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